- Soldering Iron: Used to solder small components like capacitor, resistor, diode, transistor, regulator, speaker, microphone, display etc. A 50 watt soldering iron is good enough for most mobile phone repairing job. When buying a soldering iron, select the one that is easy to hold and does not burn you hand. The soldering iron must have option to choose and select different types and shapes of soldering tips or bits. These tips or bits must be replaceable. It must also be ESD-Safe (Antistatic) because most electronic components in a mobile phone are very sensitive and can get damaged due to static charge or static electricity. Hakko and Weller are two world renowned brands who manufacture, sell and export world class soldering irons and other soldering tools and equipments.
- Soldering Station: A soldering station has 2 units – a station and an iron. It has option to control temperature depending on the heat requirement of the soldering job being done. The soldering iron is attached with the soldering station. It is better and more convenient than traditional soldering iron. It makes soldering work much easier and faster. When buying a soldering station for mobile phone repairing one must always select an ESD-Safe (Antistatic) model. Hakko and Weller are two world renowned brands who manufacture, sell and export world class soldering irons and other soldering tools and equipments.
- PCB Holder / PCB Stand: A PCB (Printed Circuit Board) holder or PCB stand is used to old the PCB of a mobile phone while soldering or repairing. It holds the PCB very strongly and doesn’t allows it to move thus helping in repairing. Again, it is important and wise to select a good quality PCB holder rather than a cheaper and inexpensive one.
- Solder Wire: Solder wire is used to solder electronic components, ICs or jumper. Composition of most solder wire is Tin / Lead in the ratio 60:40 or 63:37. Since the introduction of RoHS (Restriction of Hazardous Substances) from electronics, more and more companies are using lead-free solder. Lead-free solder wire is available in many compositions but the most common composition is Tin / Silver / Copper in the Ratio 96.5:3.0:0.5. Solder wire is available in different diameters such 2.0mm, 1.5mm, 1.0mm, 0.5mm, 0.2mm etc. For mobile phone repairing 0.5mm solder wire is best suitable. Kester is a world renowned manufacturer and supplier of solder wire and other soldering material.
- Thinner or PCB Cleaner: Thinner or PCB cleaner is used to clean the PCB of a mobile phone. The most common PCB cleaner used in mobile phone repairing is IPA or Isopropyl Alcohol. It is important to buy only good quality PCB cleaner as poor quality PCB cleaners can damage the board.
- Jumper Wire: This is a thin laminated or coated copper wire used to jumper from one point to another on the track of a mobile phone while repairing. Most people doing the work of mobile repairing do jumper to solve many problems.
- Blade Cutter: This is used to remove lamination from jumper wire. It can also be used for several other purposes.
- Point Cutter: It is used for cutting.
- Nose Cutter: It is used for cutting.
- Precision Screwdriver: It is used to remove and tighten screws while assembling and dissembling a mobile phone. Precision screwdrivers of sizes T4, T5, T6 and forehead are good for most mobile repairing job.
- Tweezers: These are needed to hold electronic components, ICs, jumper wire etc while soldering and Desoldering.
- Brush: These are used for cleaning the PCB of a mobile phone while repairing. It is important to buy only ESD-Safe cleaning brushes.
- Multimeter: Used to find faults, check track and components. Always buy a good quality reliable ESD-Safe digital Multimeter for mobile repairing works.
- Hot Air Blower: It is also called SMD (Surface Mount Device) rework system and SMD repair system. It has control to regulate or manage temperature and flow or hot air. Always buy a good quality ESD-Safe hot air blower.
- Battery Booster: It is used to boost the power of battery of a mobile phone.
- Ultrasonic Cleaner: Used to clean PCB of a mobile phone and electronic components.
- BGA Kit: Used to Reball and repair ball-type ICs. BGA stands for Ball Grid Array.
- Magnifying Lamp: It is used to see the magnified view of the PCB of a mobile phone. Most magnifying lamps also have light. Magnifying lamps are available in different magnification such as 3x, 4x, 5x, 10x, 50x etc.
- Mobile Opener: These are used to open the housing or body of a mobile phone.
- DC Power Supply: Regulated DC (Direct Current) power supply is used to supply DC current to a mobile phone. Most repair person used DC power supply to switch ON a mobile phone without battery.
- Liquid Flux: It is used to clean PCB track and legs or pins of electronic components while soldering. Liquid flux improves quality of soldering. Kester flux is world renowned for good quality.
- Paste Flux: This is also used while soldering.
- Solder Paste: This is solder in molted semi-solid form. It looks like paste. Solder paste is mainly used for Reballing of ICs.
- Cleaning Sponge: This is used to clean tip of soldering iron while soldering.
- Desoldering Wire: Desoldering wire or Desolder wire is used to remove excess solder from track of PCB. Chemtronics is world renowned manufacturer and supplier of Desoldering wire.
- Screwdriver Kit: It has several screwdrivers of different shapes and sizes to dissemble and assemble a mobile phone. Aven Toolsis a world renowned manufacturer, exporter and supplier of all kinds of tools and tool kits.
- IRDA or Infrared Workstation: This machine is similar to hot air blower. Only difference is that it gives heat through infrared. It is very precise and give heat only where it is needed thus preventing any damage to nearby electronic components on a PCB.
- LCD Tester: Used to check whether LCD screen of a mobile phone is faulty or not.
- Microscope: It is used to see a magnified view of PCB or electronic components. These are available in different zoom options. Many microscopes can also be connected to a computer or a monitor.
- Test JIG Box: This device is used to diagnose and find fault or problem in a mobile phone. It helps the mobile phone to work and function normally outside its case. This helps to test and check voltage and other test points on the PCB. It simple words it helps the a mobile phone to work without battery.
- Wrist Strap: It is work in the wrist of the person who is repairing a mobile phone. It helps to discharge or ground static charge thus preventing the PCB or electronic components from any damage.
- Antistatic Hand Gloves: It is important to wear ESD-Safe hand gloves while repairing a mobile phone to prevent PCB and electronic components from static charge.
- Antistatic Mat: It is laid or placed on the table or workbench where mobile repairing is done. The mat is grounded using a grounding cord or normal grounding wire. This also prevents damage from static electricity.
- Antistatic Apron: It is a dress work by people who repair mobile phones. This also helps to discharge static electricity.
- Smoke Absorber: This is like an exhaust fan that helps to filter smoke that comes out while soldering and Desoldering.
- Battery Tester: This device is used to test and analyze status or condition of battery of a mobile cell phone.
This is featured post 1 title
Replace these every slider sentences with your featured post descriptions.Go to Blogger edit html and find these sentences.Now replace these with your own descriptions.This theme is Bloggerized by Lasantha - Premiumbloggertemplates.com.
This is featured post 2 title
Replace these every slider sentences with your featured post descriptions.Go to Blogger edit html and find these sentences.Now replace these with your own descriptions.This theme is Bloggerized by Lasantha - Premiumbloggertemplates.com.
This is featured post 3 title
Replace these every slider sentences with your featured post descriptions.Go to Blogger edit html and find these sentences.Now replace these with your own descriptions.This theme is Bloggerized by Lasantha - Premiumbloggertemplates.com.
Monday, 8 December 2014
- 1G: 1St Generation in Mobile Telephony.
- 2G: 2Nd Generation in Mobile Telephony.
- 3G: 3Rd Generation in Mobile Telephony.
- 4G: 4Th Generation in Mobile Telephony.
- AC: Alternate Current.
- BGA: Ball Grid Array.
- BSI: Battery Status Indicator.
- CDMA: Code Division Multiple Access.
- CPU: Central Processing Unit.
- DCT: Digital Core Technology.
- DC: Direct Current.
- GSM: Global System for Mobile Communications.
- IMEI: International Mobile Equipment Identity.
- IC: Integrated Circuit.
- LED: Light Emitting Diode.
- PDA: Personal Digital Assistant.
- PFO: Power Frequency Oscillator.
- PCB: Printed Circuit Board.
- RAM: Random Access Memory.
- RF: Radio Frequency.
- ROM: Read Only Memory.
- RTC: Real Time Clock.
- RX: Receive / Receiver (Receiving Section).
- SMD: Surface Mount Device.
- TX: Transmit (Transmitting Section).
- UEM: Universal Energy Manager.
- VCO: Voltage-Controlled Oscillator.
Sunday, 7 December 2014
- Antenna Switch: It is found in the Network Section of a mobile phone
Work: It searches network and passes forward after tuning.
Faults: If the Antenna Switch is faulty then there will be no network in the mobile phone.
and is made up of metal and non-metal. In GSM sets it is found in white color and in CDMA sets it is found in golden metal. - P.F.O: It is found near the Antenna Switch in the Network Section of the
PCB of Mobile Phone. It is also called P.A (Power Amplifier) and Band Pass Filter.
Work: It filters and amplifies network frequency and selects the home network.
Faults: If the PFO is faulty then there will be no network in the mobile phone. If it gets short then the mobile phone will get dead. - RF IC / Hagar / Network IC: This electronic component found near
the PFO in the Network Section of a Mobile Phone. It is also called RF signal processor.
Work: It works as transmitter and receiver of audio and radio waves according to the instruction from the CPU.
Faults: If the RF IC is faulty then there will be problem with network in the mobile phone. Sometimes the mobile phone can even get dead. - 26 MHz Crystal Oscillator: It is found near the PFO in the Network
Network Crystal. It is made up of metal.
Work: It creates frequency during outgoing calls.
Faults: If this crystal is faulty then there will be no outgoing call and no network in the mobile phone.
Section of a Mobile Phone. It is also called - VCO: It is found near the Network IC in the Network Section of a Mobile
Work: It sends time, date and voltage to the RF IC / Hager and the CPU. It also creates frequency after taking command from the CPU.
Faults: If it is faulty then there will be no network in the mobile phone and it will display “Call End” or “Call Failed”.
Phone.
- RX Filter: It is found in the Network Section of a Mobile Phone.
Faults: If it is faulty then there will network problem during incoming calls.
Work: It filters frequency during incoming calls.
- TX Filter: It is found in the Network Section of a Mobile Phone.
Faults: If it is faulty then there will network problem during outgoing calls.
Work: It filters frequency during outgoing calls.
- ROM: It is found in the Power Section of a Mobile Phone.
Faults: If ROM is faulty then there will software problem in the mobile phone and the set will get dead.
Work: It loads current operating program in a Mobile Phone.
- RAM: It is found in the Power Section of a Mobile Phone.
Faults: If RAM is faulty then there will be software problem in the mobile phone and it will get frequently get hanged and the set can even get dead.
Work: It sends and receives commands of the operating program in a mobile phone.
- Flash IC: It is found in the Power Section of a Mobile Phone. It is also
Work: Software of the mobile phone is installed in the Flash IC.
Faults: If Flash IC is faulty then the mobile phone will not work properly and it can even get dead.
called EEPROM IC, Memory IC, RAM IC and ROM IC.
- Power IC: It is found in the Power Section of a Mobile Phone. There are
Work: It takes power from the battery and supplies to all other parts of a mobile phone.
Faults: If Power IC is faulty then the set will get dead.
many small components mainly capacitor around this IC. RTC is near the Power IC.
- Charging IC: It is found in the Power Section near R22.
Faults: If Charging IC is faulty then the set will not get charged. If the Charging IC is short then the set will get dead.
Work: It takes current from the charger and charges the battery.
- RTC (Simple Silicon Crystal): It is Real Time Clock and is found in
Work: It helps to run the date and time in a mobile phone.
Faults: If RTC is faulty then there will be no date or time in the mobile phone and the set can even get dead.
the Power Section near Power IC. It is made up of either metal or non-metal. It is of long shape.
- CPU: It is found in the Power Section. It is also called MAD IC, RAP IC
Work: It controls all sections of a mobile phone.
Faults: If CPU is faulty then the mobile phone will get dead.
and UPP. It is the largest IC on the PCB of a Mobile Phone and it looks different from all other ICs.
- Logic IC / UI IC: It is found in any section of a mobile phone. It has 20
Work: It controls Ringer, Vibrator and LED of a mobile phone.
Faults: If Logic IC / UI IC is faulty then Ringer, Vibrator and LED of mobile phone will nor work properly.
pins or legs. It is also called UI IC and Interface IC.
- Audio IC: It is found in Power Section of a mobile phone. It is also
Work: It controls Speaker and Microphone of a mobile phone.
Faults: If Audio IC is faulty then Speaker and Microphone of a mobile phone will not work and the set can even get dead.
called Cobba IC and Melody IC.